{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8520354","patent":{"patent_number":"US-8520354","title":"Multilayered board semiconductor device with BGA package","assignee":null,"inventors":[],"filing_date":"2012-08-13T00:00:00.000Z","publication_date":"2013-08-27T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"In a lamination type semiconductor device, in the case where a power source plane is wrapped by a closed area to prevent the needless radiation from being leaked to the outside of the semiconductor package, a planar conductor for shield having an area intersecting with the respective layers is required. However, in a device for manufacturing the lamination type semiconductor device, a process for manufacturing the above-mentioned conductor cannot be realized ordinarily. In order to make the process possible, it is required to modify or replace a manufacturing apparatus of the semiconductor device, and accordingly a manufacturing cost will be considerably increased. In the present invention, a guard ring is arranged in an surrounding area of a power source plane. The guard ring is connected to a GND plane of another layer through a via. Consequently, the RF radiation occurs between the power source plane and the guard ring."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multilayered board semiconductor device with BGA package","description":"In a lamination type semiconductor device, in the case where a power source plane is wrapped by a closed area to prevent the needless radiation from being leaked to the outside of the semiconductor pa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8520354","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8520354","citation_suggestion":"Patentable. \"Multilayered board semiconductor device with BGA package\" (US-8520354). https://patentable.app/patents/US-8520354","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8520354","json":"https://patentable.app/api/llm-context/US-8520354","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:09:16.365Z"}