{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8524539","patent":{"patent_number":"US-8524539","title":"Method of manufacturing semiconductor package","assignee":null,"inventors":[],"filing_date":"2011-08-16T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Provided are a semiconductor package of a semiconductor chip, a semiconductor module, an electronic system, and methods of manufacturing the same. The method includes mounting a semiconductor chip on a package substrate, forming a molding member on the semiconductor chip, forming via holes penetrating the molding member to expose a portion of a top surface of the semiconductor chip, the via holes being arranged in a lattice shape in a plan view, and forming thermally conductive via plugs in the via holes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing semiconductor package","description":"Provided are a semiconductor package of a semiconductor chip, a semiconductor module, an electronic system, and methods of manufacturing the same. The method includes mounting a semiconductor chip on ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8524539","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8524539","citation_suggestion":"Patentable. \"Method of manufacturing semiconductor package\" (US-8524539). https://patentable.app/patents/US-8524539","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8524539","json":"https://patentable.app/api/llm-context/US-8524539","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:15:09.045Z"}