{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8524571","patent":{"patent_number":"US-8524571","title":"Vacuum wafer level packaging method for micro electro mechanical system device","assignee":null,"inventors":[],"filing_date":"2011-12-02T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"Disclosed is a vacuum wafer level packaging method for a micro electro mechanical system device, including: forming a plurality of via holes on an upper wafer for protecting a micro electro mechanical system (MEMS) wafer; forming at least one metal layer on inner walls of the plurality of via holes and regions extended from the plurality of via holes; arranging and bonding the upper wafer and the MEMS wafer at atmospheric pressure; applying solder paste to the regions extended from the plurality of via holes; filling a solder in the plurality of via holes by increasing the temperature of a high-vacuum chamber to melt the solder paste; and changing the solder in the plurality of via holes to a solid state by lowering the temperature of the high-vacuum chamber."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Vacuum wafer level packaging method for micro electro mechanical system device","description":"Disclosed is a vacuum wafer level packaging method for a micro electro mechanical system device, including: forming a plurality of via holes on an upper wafer for protecting a micro electro mechanical","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8524571","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8524571","citation_suggestion":"Patentable. \"Vacuum wafer level packaging method for micro electro mechanical system device\" (US-8524571). https://patentable.app/patents/US-8524571","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8524571","json":"https://patentable.app/api/llm-context/US-8524571","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:10:56.914Z"}