{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8525306","patent":{"patent_number":"US-8525306","title":"Semiconductor device and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2011-06-22T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"To suppress a short circuit between neighboring wires which is caused when the loop of a wire is formed into multiple stages in a semiconductor device in which a wiring board and one semiconductor chip mounted over a main surface thereof are electrically coupled with the wire. In a semiconductor device in which a chip is mounted on an upper surface of a wiring board and a bonding lead of the wiring board and a bonding pad of the chip are electrically coupled with wires, a short circuit between the neighboring wires is suppressed by making larger the diameter of the longest wire arranged in a position closest to a corner part of the chip than the diameter of the other wires."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method of manufacturing the same","description":"To suppress a short circuit between neighboring wires which is caused when the loop of a wire is formed into multiple stages in a semiconductor device in which a wiring board and one semiconductor chi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8525306","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8525306","citation_suggestion":"Patentable. \"Semiconductor device and method of manufacturing the same\" (US-8525306). https://patentable.app/patents/US-8525306","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8525306","json":"https://patentable.app/api/llm-context/US-8525306","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:10:44.865Z"}