{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8525307","patent":{"patent_number":"US-8525307","title":"Semiconductor device, lead frame assembly, and method for fabricating the same","assignee":null,"inventors":[],"filing_date":"2011-07-27T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device, lead frame assembly, and method for fabricating the same","description":"A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8525307","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8525307","citation_suggestion":"Patentable. \"Semiconductor device, lead frame assembly, and method for fabricating the same\" (US-8525307). https://patentable.app/patents/US-8525307","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8525307","json":"https://patentable.app/api/llm-context/US-8525307","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:21:03.902Z"}