{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8525329","patent":{"patent_number":"US-8525329","title":"Component stacking for integrated circuit electronic package","assignee":null,"inventors":[],"filing_date":"2012-06-29T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a component layer parallel to and aligned with a surface area of the substrate. An integrated circuit die is positioned adjacent to the component layer such that a face of the die is substantially parallel to the surface area of the substrate. The face of the die is aligned with at least a portion of the component layer, and terminals of the die are connected to the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Component stacking for integrated circuit electronic package","description":"Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete compon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8525329","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8525329","citation_suggestion":"Patentable. \"Component stacking for integrated circuit electronic package\" (US-8525329). https://patentable.app/patents/US-8525329","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8525329","json":"https://patentable.app/api/llm-context/US-8525329","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:30:05.701Z"}