{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8525338","patent":{"patent_number":"US-8525338","title":"Chip with sintered connections to package","assignee":null,"inventors":[],"filing_date":"2011-06-07T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge surface can be disposed at a periphery of the substrate or can be the edge surface of an aperture within the substrate. A microelectronic element has a front face and contacts thereon, with at least some of the contacts being adjacent to the edge surface of the substrate. A dielectric material overlies the edge surface of the substrate and defines a sloping surface between the front face of the microelectronic element and the substrate. A conductive matrix material defines a plurality of conductive interconnects extending along the sloping surface. The conductive interconnects electrically interconnect respective ones of the contacts with the conductive elements."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip with sintered connections to package","description":"A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of term","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8525338","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8525338","citation_suggestion":"Patentable. \"Chip with sintered connections to package\" (US-8525338). https://patentable.app/patents/US-8525338","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8525338","json":"https://patentable.app/api/llm-context/US-8525338","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:15:32.791Z"}