{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8525345","patent":{"patent_number":"US-8525345","title":"Chip package and method for forming the same","assignee":null,"inventors":[],"filing_date":"2011-03-09T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"According to an embodiment of the invention, a chip package is provided. The chip package includes a substrate having an upper surface and a lower surface, a plurality of conducting pads located in the substrate or under the lower surface thereof, a dielectric layer located between the conducting pads, a hole extending from the upper surface towards the lower surface of the substrate and exposing a portion of the conducting pads, and a conducting layer located in the hole and electrically contacting the conducting pads."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package and method for forming the same","description":"According to an embodiment of the invention, a chip package is provided. The chip package includes a substrate having an upper surface and a lower surface, a plurality of conducting pads located in th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8525345","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8525345","citation_suggestion":"Patentable. \"Chip package and method for forming the same\" (US-8525345). https://patentable.app/patents/US-8525345","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8525345","json":"https://patentable.app/api/llm-context/US-8525345","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:13:32.224Z"}