{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8525350","patent":{"patent_number":"US-8525350","title":"Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps","assignee":null,"inventors":[],"filing_date":"2010-03-25T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"A semiconductor device has a semiconductor die with bond pads formed on a surface of the semiconductor die. A UBM is formed over the bond pads of the semiconductor die. A fusible layer is formed over the UBM. The fusible layer can be tin or tin alloy. A substrate has bond pads formed on a surface of the substrate. A plurality of stud bumps containing non-fusible material is formed over the bond pads on the substrate. Each stud bump includes a wire having a first end attached to the bond pad of the substrate and second end of uniform height electrically connected to the bond pad of the semiconductor die by reflowing the fusible layer or applying thermal compression bonding. An underfill material is deposited between the semiconductor die and substrate. An encapsulant is deposited over the semiconductor die and substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps","description":"A semiconductor device has a semiconductor die with bond pads formed on a surface of the semiconductor die. A UBM is formed over the bond pads of the semiconductor die. A fusible layer is formed over ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8525350","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8525350","citation_suggestion":"Patentable. \"Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps\" (US-8525350). https://patentable.app/patents/US-8525350","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8525350","json":"https://patentable.app/api/llm-context/US-8525350","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T16:22:26.369Z"}