{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8526177","patent":{"patent_number":"US-8526177","title":"Fan for cooling multiple processors housed in a sub-chassis","assignee":null,"inventors":[],"filing_date":"2010-05-04T00:00:00.000Z","publication_date":"2013-09-03T00:00:00.000Z","cpc_codes":["G06F"],"num_claims":14,"abstract":"A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan for cooling multiple processors housed in a sub-chassis","description":"A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8526177","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8526177","citation_suggestion":"Patentable. \"Fan for cooling multiple processors housed in a sub-chassis\" (US-8526177). https://patentable.app/patents/US-8526177","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8526177","json":"https://patentable.app/api/llm-context/US-8526177","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T08:26:52.869Z"}