{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8530280","patent":{"patent_number":"US-8530280","title":"Integrated circuit package system with contoured encapsulation and method for manufacturing thereof","assignee":null,"inventors":[],"filing_date":"2011-07-07T00:00:00.000Z","publication_date":"2013-09-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A method for manufacturing an integrated circuit package system includes: providing a carrier; mounting an integrated circuit die on a top side of the carrier; connecting the integrated circuit die with the carrier; forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress; and forming a first external interconnect on the top side of the carrier adjacent to and separated from the encapsulation including forming a second external interconnect on a bottom side of the carrier opposite the first external interconnect."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package system with contoured encapsulation and method for manufacturing thereof","description":"A method for manufacturing an integrated circuit package system includes: providing a carrier; mounting an integrated circuit die on a top side of the carrier; connecting the integrated circuit die wi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8530280","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8530280","citation_suggestion":"Patentable. \"Integrated circuit package system with contoured encapsulation and method for manufacturing thereof\" (US-8530280). https://patentable.app/patents/US-8530280","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8530280","json":"https://patentable.app/api/llm-context/US-8530280","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:20:54.379Z"}