{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8530281","patent":{"patent_number":"US-8530281","title":"Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip","assignee":null,"inventors":[],"filing_date":"2011-06-23T00:00:00.000Z","publication_date":"2013-09-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A method of producing a semiconductor module which includes a resin molded package and a coolant passage is provided. The resin molded package is made up of a thermosetting resin-made mold and a thermoplastic resin-made mold. The resin molded package is formed by making the thermoplastic resin-made mold, placing the thermoplastic resin-made mold and a semiconductor sub-assembly made up of a power semiconductor chip, heat spreaders, terminals, etc., and then forming the thermosetting resin-made mold. Specifically, the thermosetting resin-made mold is made after the thermoplastic resin-made mold, thereby creating a high degree of adhesion of the thermosetting resin-made mold to the thermoplastic resin-made mold before the thermosetting resin-made mold is hardened completely, thereby forming firmly an adhered interface between the thermosetting resin-made mold and the thermoplastic resin-made mold. This minimizes the risk of occurrence of air gaps at the adhered interface and avoids the leakage of the coolant outside the resin molded package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip","description":"A method of producing a semiconductor module which includes a resin molded package and a coolant passage is provided. The resin molded package is made up of a thermosetting resin-made mold and a therm","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8530281","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8530281","citation_suggestion":"Patentable. \"Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip\" (US-8530281). https://patentable.app/patents/US-8530281","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8530281","json":"https://patentable.app/api/llm-context/US-8530281","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:55:09.935Z"}