{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8530346","patent":{"patent_number":"US-8530346","title":"Process of forming an electronic device including a conductive stud over a bonding pad region","assignee":null,"inventors":[],"filing_date":"2010-10-11T00:00:00.000Z","publication_date":"2013-09-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An electronic device can include an interconnect level including a bonding pad region. An insulating layer can overlie the interconnect level and include an opening over the bonding pad region. In one embodiment, a conductive stud can lie within the opening and can be substantially encapsulated. In another embodiment, the electronic device can include a barrier layer lying along a side and a bottom of the opening and a conductive stud lying within the opening. The conductive stud can substantially fill the opening. A majority of the conductive stud can lie within the opening. In still another embodiment, a process for forming an electronic device can include forming a conductive stud within the opening wherein from a top view, the conductive stud lies substantially completely within the opening. The process can also include forming a second barrier layer overlying the conductive stud."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Process of forming an electronic device including a conductive stud over a bonding pad region","description":"An electronic device can include an interconnect level including a bonding pad region. An insulating layer can overlie the interconnect level and include an opening over the bonding pad region. In one","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8530346","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8530346","citation_suggestion":"Patentable. \"Process of forming an electronic device including a conductive stud over a bonding pad region\" (US-8530346). https://patentable.app/patents/US-8530346","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8530346","json":"https://patentable.app/api/llm-context/US-8530346","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T10:10:49.232Z"}