{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8530351","patent":{"patent_number":"US-8530351","title":"Semiconductor package and fabrication method","assignee":null,"inventors":[],"filing_date":"2010-10-15T00:00:00.000Z","publication_date":"2013-09-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achieving a fine pitch of the terminals. The semiconductor package includes a board (20) including a plurality of insulating resin layers, semiconductor element-mounting terminals (18) formed on the uppermost surface of the board, and external connection terminals (12) formed on the bottom surface thereof. Each external connection terminal (12) is formed as a bump projected downward from the bottom surface of the package, and each bump is filled with the insulating resin (14) while the surface thereof is covered by a metal (16). Wiring (24), (26) including a conductor via (26a) electrically connect the metal of the metal layer 16 and the semiconductor element-mounting terminals (18)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and fabrication method","description":"A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals co","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8530351","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8530351","citation_suggestion":"Patentable. \"Semiconductor package and fabrication method\" (US-8530351). https://patentable.app/patents/US-8530351","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8530351","json":"https://patentable.app/api/llm-context/US-8530351","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:37:33.741Z"}