{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8530986","patent":{"patent_number":"US-8530986","title":"Manufacturing method of electronic device package, electronic device package, and oscillator","assignee":null,"inventors":[],"filing_date":"2011-03-24T00:00:00.000Z","publication_date":"2013-09-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A manufacturing method of an electronic device package includes: forming concave portions that later form the cavities in one surface of a cover substrate; forming a first metal film on the cover substrate on a surface opposite to the surface in which the concave portions are formed; forming a second metal film on the cover substrate on the surface in which the concave portions are formed; bonding a base substrate and the cover substrate together via the second metal film. It thus becomes possible to provide an electronic device package in which the base substrate and the cover substrate are boned together via the metal film in a stable manner by minimizing warping of the substrate even when the substrate is made thinner."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method of electronic device package, electronic device package, and oscillator","description":"A manufacturing method of an electronic device package includes: forming concave portions that later form the cavities in one surface of a cover substrate; forming a first metal film on the cover subs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8530986","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8530986","citation_suggestion":"Patentable. \"Manufacturing method of electronic device package, electronic device package, and oscillator\" (US-8530986). https://patentable.app/patents/US-8530986","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8530986","json":"https://patentable.app/api/llm-context/US-8530986","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:19:19.952Z"}