{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8531030","patent":{"patent_number":"US-8531030","title":"IC device having electromigration resistant feed line structures","assignee":null,"inventors":[],"filing_date":"2010-12-16T00:00:00.000Z","publication_date":"2013-09-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"An integrated circuit (IC) device includes an electromigration resistant feed line. The IC device includes a substrate including active circuitry. A back end of the line (BEOL) metallization stack includes an interconnect metal layer that is coupled to a bond pad by the EM resistant feed line. A bonding feature is on the bond pad. The feed line includes a uniform portion and patterned trace portion that extends to the bond pad which includes at least three sub-traces that are electrically in parallel. The sub-traces are sized so that a number of squares associated with each of the sub-traces are within a range of a mean number of squares for the sub-traces plus or minus twenty percent or a current density provided to the bonding feature through each sub-trace is within a range of a mean current density provided to the bonding feature plus or minus twenty percent."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"IC device having electromigration resistant feed line structures","description":"An integrated circuit (IC) device includes an electromigration resistant feed line. The IC device includes a substrate including active circuitry. A back end of the line (BEOL) metallization stack inc","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8531030","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8531030","citation_suggestion":"Patentable. \"IC device having electromigration resistant feed line structures\" (US-8531030). https://patentable.app/patents/US-8531030","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8531030","json":"https://patentable.app/api/llm-context/US-8531030","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:17:12.210Z"}