{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8531040","patent":{"patent_number":"US-8531040","title":"Controlled area solder bonding for dies","assignee":null,"inventors":[],"filing_date":"2012-03-14T00:00:00.000Z","publication_date":"2013-09-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of fabricating a semiconductor comprises forming a plurality of stud bumps in a pattern having a geometrical shape on a surface of a substrate, the pattern defining a periphery of a bonding area on the surface of the substrate, and placing a solder material in the bonding area such that the solder material is surrounded by the stud bumps. The solder material is heated to a temperature where the solder material begins to flow within the bonding area. A bonding surface of a die is pressed onto the stud bumps with a sufficient pressure to crush the stud bumps a predetermined extent such that the solder material substantially evenly spreads between the stud bumps within the bonding area. The solder material is then solidified to form a final solder area that conforms to the geometrical shape of the pattern of stud bumps."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Controlled area solder bonding for dies","description":"A method of fabricating a semiconductor comprises forming a plurality of stud bumps in a pattern having a geometrical shape on a surface of a substrate, the pattern defining a periphery of a bonding a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8531040","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8531040","citation_suggestion":"Patentable. \"Controlled area solder bonding for dies\" (US-8531040). https://patentable.app/patents/US-8531040","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8531040","json":"https://patentable.app/api/llm-context/US-8531040","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:29:23.986Z"}