{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8535546","patent":{"patent_number":"US-8535546","title":"Method of manufacturing multilayer wiring substrate","assignee":null,"inventors":[],"filing_date":"2011-12-06T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":11,"abstract":"In order to provide a method of manufacturing a multilayer wiring substrate, a base member having a copper foil separably laminated thereon is prepared, and a solder resist layer is formed on the copper foil. Openings are formed in the solder resist layer, and a metal conductor portion is formed in each of the openings. By means of sputtering, a dissimilar metal layer is formed over the surface of the metal conductor portion and the entire surface of the solder resist layer. Copper electroplating is performed so as to form connection terminals and a conductor layer on the dissimilar metal layer. After a build-up step, the base material is removed, whereby the copper foil is exposed, and the exposed copper foil and the metal conductor portion are removed through etching, whereby the surfaces of the external connection terminals are exposed from the openings."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing multilayer wiring substrate","description":"In order to provide a method of manufacturing a multilayer wiring substrate, a base member having a copper foil separably laminated thereon is prepared, and a solder resist layer is formed on the copp","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8535546","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8535546","citation_suggestion":"Patentable. \"Method of manufacturing multilayer wiring substrate\" (US-8535546). https://patentable.app/patents/US-8535546","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8535546","json":"https://patentable.app/api/llm-context/US-8535546","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:54:37.689Z"}