{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8535981","patent":{"patent_number":"US-8535981","title":"Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2011-03-10T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A method of manufacturing of an integrated circuit packaging system includes: providing a bottom package in a cavity in a central region of the bottom package having inter-package interconnects in the cavity; forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity; mounting a top package on the inter-package interconnects; and applying an underfill through the vent and into the cavity."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof","description":"A method of manufacturing of an integrated circuit packaging system includes: providing a bottom package in a cavity in a central region of the bottom package having inter-package interconnects in the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8535981","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8535981","citation_suggestion":"Patentable. \"Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof\" (US-8535981). https://patentable.app/patents/US-8535981","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8535981","json":"https://patentable.app/api/llm-context/US-8535981","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:56:03.552Z"}