{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8535982","patent":{"patent_number":"US-8535982","title":"Providing an automatic optical inspection feature for solder joints on semiconductor packages","assignee":null,"inventors":[],"filing_date":"2012-11-29T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A mechanism is provided by which optically-inspectable features formed during surface mount bonding of no-leads packages are enhanced. Embodiments of the present invention use a lead frame having features that will lie upon the edges of the finished semiconductor device package, where molding material is prevented from lying in those features through the use of a preplaced film on the lead frame or film-assisted molding in conjunction with a mold chase that conforms to the features provided on the lead frame. Embodiments use a lead frame that has a pre-plated solderable surface, such that the exposed features enhance formation of the optically-inspectable features during solder reflow operations of PCB mounting."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Providing an automatic optical inspection feature for solder joints on semiconductor packages","description":"A mechanism is provided by which optically-inspectable features formed during surface mount bonding of no-leads packages are enhanced. Embodiments of the present invention use a lead frame having feat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8535982","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8535982","citation_suggestion":"Patentable. \"Providing an automatic optical inspection feature for solder joints on semiconductor packages\" (US-8535982). https://patentable.app/patents/US-8535982","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8535982","json":"https://patentable.app/api/llm-context/US-8535982","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T09:56:28.227Z"}