{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8535985","patent":{"patent_number":"US-8535985","title":"Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump","assignee":null,"inventors":[],"filing_date":"2011-03-20T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":32,"abstract":"A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the bump opposite a cavity in the bump, wherein a heat spreader includes the bump and a base that includes a portion of the ledge adjacent to the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump","description":"A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a condu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8535985","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8535985","citation_suggestion":"Patentable. \"Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump\" (US-8535985). https://patentable.app/patents/US-8535985","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8535985","json":"https://patentable.app/api/llm-context/US-8535985","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:53:47.030Z"}