{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8536004","patent":{"patent_number":"US-8536004","title":"Method for fabricating semiconductor power device","assignee":null,"inventors":[],"filing_date":"2011-08-17T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":11,"abstract":"A method for fabricating a semiconductor power device includes the following steps. First, a substrate having at least a semiconductor layer and a pad layer thereon is provided. At least a trench is etched into the pad layer and the semiconductor layer. Then, a dopant source layer is deposited in the trench and on the pad layer followed by thermally driving in dopants of the dopant source layer into the semiconductor layer. A polishing process is performed to remove the dopant source layer from a surface of the pad layer and a thermal oxidation process is performed to eliminate micro-scratches formed during the polishing process. Finally, the pad layer is removed to expose the semiconductor layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for fabricating semiconductor power device","description":"A method for fabricating a semiconductor power device includes the following steps. First, a substrate having at least a semiconductor layer and a pad layer thereon is provided. At least a trench is e","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8536004","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8536004","citation_suggestion":"Patentable. \"Method for fabricating semiconductor power device\" (US-8536004). https://patentable.app/patents/US-8536004","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8536004","json":"https://patentable.app/api/llm-context/US-8536004","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:46:14.895Z"}