{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8536687","patent":{"patent_number":"US-8536687","title":"Semiconductor device having separated heatsink and chip mounting portion","assignee":null,"inventors":[],"filing_date":"2012-01-09T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A technology with which the reliability of a package making up a semiconductor device can be enhanced is provided. A feature of the technical idea of the invention is that: a heat sink unit and an outer lead unit are separated from each other: and the outer lead unit is provided with chip placement portions and each of the chip placement portions and each heat sink are joined together. As a result, when a sealing body is formed at a resin sealing step, tying portions function as a stopper for preventing resin leakage and the formation of resin burr in a package product can be thereby prevented. In addition, camber does not occur in the heat sink unit and cracking in a sealing body caused by winding (camber) can be suppressed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having separated heatsink and chip mounting portion","description":"A technology with which the reliability of a package making up a semiconductor device can be enhanced is provided. A feature of the technical idea of the invention is that: a heat sink unit and an out","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8536687","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8536687","citation_suggestion":"Patentable. \"Semiconductor device having separated heatsink and chip mounting portion\" (US-8536687). https://patentable.app/patents/US-8536687","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8536687","json":"https://patentable.app/api/llm-context/US-8536687","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:12:23.608Z"}