{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8536697","patent":{"patent_number":"US-8536697","title":"Packaged die for heat dissipation and method therefor","assignee":null,"inventors":[],"filing_date":"2011-11-30T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A heat spreader die holder that covers at least 50% of both major sides of a semiconductor die. The heat spreader die holder includes at least one opening. The heat spreader die holder is attached to a substrate. Electrically conductive structures of the die are electrically coupled to electrically conductive structures of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaged die for heat dissipation and method therefor","description":"A heat spreader die holder that covers at least 50% of both major sides of a semiconductor die. The heat spreader die holder includes at least one opening. The heat spreader die holder is attached to ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8536697","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8536697","citation_suggestion":"Patentable. \"Packaged die for heat dissipation and method therefor\" (US-8536697). https://patentable.app/patents/US-8536697","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8536697","json":"https://patentable.app/api/llm-context/US-8536697","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:12:07.901Z"}