{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8536895","patent":{"patent_number":"US-8536895","title":"Configuration of a multi-die integrated circuit","assignee":null,"inventors":[],"filing_date":"2011-09-30T00:00:00.000Z","publication_date":"2013-09-17T00:00:00.000Z","cpc_codes":["G06F","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated through the interposer; and a second die on the surface of the interposer and coupled to the global signal. The first die and the second die each is configured to implement a same operating state concurrently in response to the global signal."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Configuration of a multi-die integrated circuit","description":"An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated throu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8536895","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8536895","citation_suggestion":"Patentable. \"Configuration of a multi-die integrated circuit\" (US-8536895). https://patentable.app/patents/US-8536895","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8536895","json":"https://patentable.app/api/llm-context/US-8536895","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:48:05.449Z"}