{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8540001","patent":{"patent_number":"US-8540001","title":"Die bonder and semiconductor manufacturing method","assignee":null,"inventors":[],"filing_date":"2011-03-09T00:00:00.000Z","publication_date":"2013-09-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Die bonder and semiconductor manufacturing method","description":"The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8540001","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8540001","citation_suggestion":"Patentable. \"Die bonder and semiconductor manufacturing method\" (US-8540001). https://patentable.app/patents/US-8540001","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8540001","json":"https://patentable.app/api/llm-context/US-8540001","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T02:41:37.321Z"}