{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8540135","patent":{"patent_number":"US-8540135","title":"Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same","assignee":null,"inventors":[],"filing_date":"2011-03-10T00:00:00.000Z","publication_date":"2013-09-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105. "},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same","description":"Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8540135","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8540135","citation_suggestion":"Patentable. \"Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same\" (US-8540135). https://patentable.app/patents/US-8540135","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8540135","json":"https://patentable.app/api/llm-context/US-8540135","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:09:25.206Z"}