{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8541249","patent":{"patent_number":"US-8541249","title":"Method for manufacturing light emitting device package and frame for manufacturing light emitting device package","assignee":null,"inventors":[],"filing_date":"2011-11-07T00:00:00.000Z","publication_date":"2013-09-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":13,"abstract":"A method for manufacturing a light emitting device package includes: preparing a base frame including an annular base part, at least a pair of lead parts extending to an inner side of the base part, and at least one support part extending to the inner side of the base part in a direction different from that of the lead parts and having a step structure formed on at least one surface of an end thereof; forming a package main body such that the package main body is combined to the step structure of the support part; separating the lead parts from the base part; disposing a light emitting device on at least one of the lead parts; and separating the package main body from the support part."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing light emitting device package and frame for manufacturing light emitting device package","description":"A method for manufacturing a light emitting device package includes: preparing a base frame including an annular base part, at least a pair of lead parts extending to an inner side of the base part, a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8541249","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8541249","citation_suggestion":"Patentable. \"Method for manufacturing light emitting device package and frame for manufacturing light emitting device package\" (US-8541249). https://patentable.app/patents/US-8541249","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8541249","json":"https://patentable.app/api/llm-context/US-8541249","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:15:23.035Z"}