{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8541263","patent":{"patent_number":"US-8541263","title":"Thermoset molding for on-package decoupling in flip chips","assignee":null,"inventors":[],"filing_date":"2008-08-22T00:00:00.000Z","publication_date":"2013-09-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":21,"abstract":"In an exemplary embodiment, a method takes as an input a package substrate on which multiple capacitors have been mounted in a ring as part of a design to effectuate on-package decoupling. The method involves plasma cleaning the package substrate and the capacitors to remove organic contaminants. The method then involves applying a thermoset plastic to encase the capacitors on the package substrate. In one embodiment, a heated metal mold is utilized and the thermoset plastic is placed therein. The method includes opening the metal mold and curing the molded thermoset plastic by baking the molded thermoset plastic at an elevated temperature."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermoset molding for on-package decoupling in flip chips","description":"In an exemplary embodiment, a method takes as an input a package substrate on which multiple capacitors have been mounted in a ring as part of a design to effectuate on-package decoupling. The method ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8541263","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8541263","citation_suggestion":"Patentable. \"Thermoset molding for on-package decoupling in flip chips\" (US-8541263). https://patentable.app/patents/US-8541263","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8541263","json":"https://patentable.app/api/llm-context/US-8541263","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:34:57.147Z"}