{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8541304","patent":{"patent_number":"US-8541304","title":"Production of TSV interconnection structures made up of an insulating contour and a conductive zone situated in the contour and disconnected from the contour","assignee":null,"inventors":[],"filing_date":"2010-12-14T00:00:00.000Z","publication_date":"2013-09-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"A method for producing an interconnection structure is disclosed. In one aspect, there is formation in a substrate of at least one trench forming a closed contour and at least one hole situated inside the closed contour, the trench and the hole being separated by a zone of the substrate. Furthermore, the trench is filled with a dielectric material and the hole is filled with a conducting material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Production of TSV interconnection structures made up of an insulating contour and a conductive zone situated in the contour and disconnected from the contour","description":"A method for producing an interconnection structure is disclosed. In one aspect, there is formation in a substrate of at least one trench forming a closed contour and at least one hole situated inside","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8541304","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8541304","citation_suggestion":"Patentable. \"Production of TSV interconnection structures made up of an insulating contour and a conductive zone situated in the contour and disconnected from the contour\" (US-8541304). https://patentable.app/patents/US-8541304","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8541304","json":"https://patentable.app/api/llm-context/US-8541304","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:22:53.139Z"}