{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8541872","patent":{"patent_number":"US-8541872","title":"Integrated circuit package system with package stacking and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2010-06-02T00:00:00.000Z","publication_date":"2013-09-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of manufacture of an integrated circuit package system includes: forming a non-inverted internal stacking module including: fabricating an internal stacking module (ISM) substrate having an ISM component side and an ISM coupling side, coupling an internal stacking module integrated circuit to the ISM component side, coupling stacking structures, adjacent to the internal stacking module integrated circuit, on the ISM component side, and molding a stacking module body having a top surface that is coplanar with and exposes the stacking structures; forming a base package substrate under the non-inverted internal stacking module; coupling middle structures between the base package substrate and the ISM coupling side; and forming a base package body on the base package substrate, the middle structures, and the non-inverted internal stacking module including exposing the top surface of the stacking module body to be coplanar with the base package body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package system with package stacking and method of manufacture thereof","description":"A method of manufacture of an integrated circuit package system includes: forming a non-inverted internal stacking module including: fabricating an internal stacking module (ISM) substrate having an I","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8541872","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8541872","citation_suggestion":"Patentable. \"Integrated circuit package system with package stacking and method of manufacture thereof\" (US-8541872). https://patentable.app/patents/US-8541872","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8541872","json":"https://patentable.app/api/llm-context/US-8541872","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:31:59.574Z"}