{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8541882","patent":{"patent_number":"US-8541882","title":"Stacked IC device with recessed conductive layers adjacent to interlevel conductors","assignee":null,"inventors":[],"filing_date":"2011-09-22T00:00:00.000Z","publication_date":"2013-09-24T00:00:00.000Z","cpc_codes":["G11C","G11C","H01L","H01L","H01L"],"num_claims":15,"abstract":"An IC device comprises a stack of contact levels, each including conductive layer and an insulation layer. A dielectric liner surrounds an interlevel conductor within an opening in the stack of contact levels. The opening passes through a portion of the stack of contact levels. The interlevel conductor is electrically insulated from the conductive layers of each of the contact levels through the dielectric liner. A portion of the conductive layer at the opening is recessed relative to adjacent insulation layers. The dielectric liner may have portions extending between adjacent insulation layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked IC device with recessed conductive layers adjacent to interlevel conductors","description":"An IC device comprises a stack of contact levels, each including conductive layer and an insulation layer. A dielectric liner surrounds an interlevel conductor within an opening in the stack of contac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8541882","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8541882","citation_suggestion":"Patentable. \"Stacked IC device with recessed conductive layers adjacent to interlevel conductors\" (US-8541882). https://patentable.app/patents/US-8541882","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8541882","json":"https://patentable.app/api/llm-context/US-8541882","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:23:58.689Z"}