{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589841","patent":{"patent_number":"US-9589841","title":"Electronic package and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2015-12-28T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A method for fabricating an electronic package is provided, including the steps of: providing at least a packaging structure, wherein the packaging structure has a packaging substrate having opposite first and second sides, an electronic element disposed on the first side of the packaging substrate and a plurality of conductors formed on the first side of the packaging substrate; encapsulating the packaging structure with an insulating layer, wherein the insulating layer covers the packaging substrate; and forming an RDL (Redistribution Layer) structure on the insulating layer, wherein the RDL structure is electrically connected to the conductors. Therefore, the area of the insulating layer is not required to correspond to the area of the packaging substrate, thus allowing the area of the packaging substrate to be reduced according to the practical need so as to reduce the width of the electronic package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package and fabrication method thereof","description":"A method for fabricating an electronic package is provided, including the steps of: providing at least a packaging structure, wherein the packaging structure has a packaging substrate having opposite ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589841","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589841","citation_suggestion":"Patentable. \"Electronic package and fabrication method thereof\" (US-9589841). https://patentable.app/patents/US-9589841","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589841","json":"https://patentable.app/api/llm-context/US-9589841","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:23:49.062Z"}