{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589843","patent":{"patent_number":"US-9589843","title":"Method for manufacturing a semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-03-07T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"The manufacturing efficiency of a semiconductor device is improved. A method for manufacturing a semiconductor device includes a step of sealing a semiconductor chip using a mold die having a cavity, a gate part communicating with the cavity, and a vent part provided opposite to the gate part via the cavity, and extending in a first direction in a sealing step. Further, a lead frame has a first through hole provided at a position overlapping the cavity in the sealing step, and a second through hole provided outside the first through hole, and provided at a position overlapping the vent part in the sealing step. Whereas, in a second direction crossing with the first direction, the length of the second through hole is larger than the length (groove width) of the vent part."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing a semiconductor device","description":"The manufacturing efficiency of a semiconductor device is improved. A method for manufacturing a semiconductor device includes a step of sealing a semiconductor chip using a mold die having a cavity, ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589843","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589843","citation_suggestion":"Patentable. \"Method for manufacturing a semiconductor device\" (US-9589843). https://patentable.app/patents/US-9589843","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589843","json":"https://patentable.app/api/llm-context/US-9589843","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:41:36.892Z"}