{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589861","patent":{"patent_number":"US-9589861","title":"Semiconductor packaging having warpage control and methods of forming same","assignee":null,"inventors":[],"filing_date":"2016-06-23T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment method for forming a semiconductor device package comprises bonding a first die to a package substrate and forming a molding compound over the package substrate and around the first die. A surface of the first die opposing the package substrate is exposed after forming the molding compound. The method further comprises bonding a plurality of second dies to the surface of the first die opposing the package substrate after forming the molding compound."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packaging having warpage control and methods of forming same","description":"An embodiment method for forming a semiconductor device package comprises bonding a first die to a package substrate and forming a molding compound over the package substrate and around the first die.","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589861","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589861","citation_suggestion":"Patentable. \"Semiconductor packaging having warpage control and methods of forming same\" (US-9589861). https://patentable.app/patents/US-9589861","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589861","json":"https://patentable.app/api/llm-context/US-9589861","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:23:38.427Z"}