{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589890","patent":{"patent_number":"US-9589890","title":"Method for interconnect scheme","assignee":null,"inventors":[],"filing_date":"2015-07-20T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of fabricating a semiconductor device is disclosed. The method includes forming a first dielectric layer over a substrate, forming a first trench in the first dielectric layer, forming a metal line in the first trench, removing a first portion of the metal line to form a second trench and removing a second portion of the metal line to form a third trench. A third portion of the metal line is disposed between the second and third trenches. The method also includes forming a second dielectric layer in the second and third trenches."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for interconnect scheme","description":"A method of fabricating a semiconductor device is disclosed. The method includes forming a first dielectric layer over a substrate, forming a first trench in the first dielectric layer, forming a meta","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589890","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589890","citation_suggestion":"Patentable. \"Method for interconnect scheme\" (US-9589890). https://patentable.app/patents/US-9589890","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589890","json":"https://patentable.app/api/llm-context/US-9589890","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:22:00.188Z"}