{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589905","patent":{"patent_number":"US-9589905","title":"EMI shielding in semiconductor packages","assignee":null,"inventors":[],"filing_date":"2014-04-04T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":3,"abstract":"A semiconductor package includes a substrate, a chip disposed over a top surface of the substrate, an electromagnetic interference (EMI) shielding layer disposed over the substrate such that the EMI shielding layer surrounds the chip, a ground pad disposed in the substrate to contact a bottom surface of the substrate, and a test pad disposed in the substrate to contact the bottom surface of the substrate and spaced apart from the ground pad. A method of testing the semiconductor package is performed using a loop circuit to which a current is applied, the loop circuit being formed by electrically coupling the ground pad, the EMI shielding layer, and the test pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"EMI shielding in semiconductor packages","description":"A semiconductor package includes a substrate, a chip disposed over a top surface of the substrate, an electromagnetic interference (EMI) shielding layer disposed over the substrate such that the EMI s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589905","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589905","citation_suggestion":"Patentable. \"EMI shielding in semiconductor packages\" (US-9589905). https://patentable.app/patents/US-9589905","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589905","json":"https://patentable.app/api/llm-context/US-9589905","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:04:43.738Z"}