{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589906","patent":{"patent_number":"US-9589906","title":"Semiconductor device package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2015-02-27T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"The present disclosure relates to a semiconductor device package and a manufacturing method thereof. The semiconductor package comprises a die pad, a row of leads, a component, a package body, and a conformal shield. The die pad has a top surface. The row of leads comprises a first lead and a second lead, and the row of leads is arranged along a side of the die pad. The first lead has a first lateral surface, and the second lead has a second lateral surface. The component is disposed on the top surface of the die pad. The package body encapsulates the component, the die pad, the first lead, and the second lead, exposes the first lateral surface of the first lead, and covers the second lateral surface of the second lead. The conformal shield covers the package body and connects to the first lateral surface of the first lead."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package and method of manufacturing the same","description":"The present disclosure relates to a semiconductor device package and a manufacturing method thereof. The semiconductor package comprises a die pad, a row of leads, a component, a package body, and a c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589906","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589906","citation_suggestion":"Patentable. \"Semiconductor device package and method of manufacturing the same\" (US-9589906). https://patentable.app/patents/US-9589906","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589906","json":"https://patentable.app/api/llm-context/US-9589906","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:02:41.403Z"}