{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589908","patent":{"patent_number":"US-9589908","title":"Methods to improve BGA package isolation in radio frequency and millimeter wave products","assignee":null,"inventors":[],"filing_date":"2015-09-29T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method and apparatus are provided for manufacturing a packaged electronic device (200) which includes a carrier substrate (120) in which conductive interconnect paths (122) extend between first and second opposed surfaces, an integrated circuit die (125) affixed to the first surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, and an array of conductors (110), such as BGA, LGA, PGA, C4 bump or flip chip conductors, affixed to the second surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, where the array comprising a signal feed ball (112) and an array of shielding ground balls (111) surrounding the signal feed ball."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods to improve BGA package isolation in radio frequency and millimeter wave products","description":"A method and apparatus are provided for manufacturing a packaged electronic device (200) which includes a carrier substrate (120) in which conductive interconnect paths (122) extend between first and ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589908","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589908","citation_suggestion":"Patentable. \"Methods to improve BGA package isolation in radio frequency and millimeter wave products\" (US-9589908). https://patentable.app/patents/US-9589908","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589908","json":"https://patentable.app/api/llm-context/US-9589908","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:17:39.306Z"}