{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589909","patent":{"patent_number":"US-9589909","title":"Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers","assignee":null,"inventors":[],"filing_date":"2015-10-23T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"Radio frequency/electromagnetic interference (RF/EMI) shielding within redistribution layers of a fan-out wafer level package is provided. By using RDL metal layers to provide the shielding, additional process steps are avoided (e.g., incorporating a shielding lid or applying conformal paint on the package back side). Embodiments use metal filled trench vias in the RDL dielectric layers to provide metal “walls” around the RF sensitive signal lines through the dielectric layer regions of the RDL. These walls are coupled to ground, which isolates the signal lines from interference or noise generated outside the walls."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers","description":"Radio frequency/electromagnetic interference (RF/EMI) shielding within redistribution layers of a fan-out wafer level package is provided. By using RDL metal layers to provide the shielding, additiona","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589909","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589909","citation_suggestion":"Patentable. \"Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers\" (US-9589909). https://patentable.app/patents/US-9589909","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589909","json":"https://patentable.app/api/llm-context/US-9589909","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:07:19.646Z"}