{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589913","patent":{"patent_number":"US-9589913","title":"Flip chip stacking utilizing interposer","assignee":null,"inventors":[],"filing_date":"2013-03-29T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"An interposer and a method for stacking dies utilizing such an interposer in an integrated circuit are disclosed. The interposer includes a substrate and a plurality of vias defined in the substrate. At least one of the plurality of vias of the interposer is positioned to establish a connection with at least one of the plurality of vias of a first die. At least one additional die is positioned to establish a connection with the first die utilizing the connection established between the interposer and the first die through at least one of the vias."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Flip chip stacking utilizing interposer","description":"An interposer and a method for stacking dies utilizing such an interposer in an integrated circuit are disclosed. The interposer includes a substrate and a plurality of vias defined in the substrate. ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589913","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589913","citation_suggestion":"Patentable. \"Flip chip stacking utilizing interposer\" (US-9589913). https://patentable.app/patents/US-9589913","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589913","json":"https://patentable.app/api/llm-context/US-9589913","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:19:43.906Z"}