{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589915","patent":{"patent_number":"US-9589915","title":"Semiconductor device and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2014-07-17T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a substrate defined with a seal ring region and a circuit region, the substrate includes a seal ring structure and an integrated circuit structure, the seal ring structure is disposed in the seal ring region and includes a plurality of stacked conductive layers interconnected by a plurality of via layers, the integrated circuit structure is disposed in the circuit region and includes an active or a passive device; a metal pad disposed over the seal ring region and contacted with the seal ring structure; a passivation layer disposed over the substrate and covering the metal pad; a polymeric layer disposed over the passivation layer and the circuit region; and a molding disposed over the passivation layer and the polymeric layer, wherein the seal ring structure is covered by the molding."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and manufacturing method thereof","description":"A semiconductor device includes a substrate defined with a seal ring region and a circuit region, the substrate includes a seal ring structure and an integrated circuit structure, the seal ring struct","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589915","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589915","citation_suggestion":"Patentable. \"Semiconductor device and manufacturing method thereof\" (US-9589915). https://patentable.app/patents/US-9589915","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589915","json":"https://patentable.app/api/llm-context/US-9589915","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:20:36.552Z"}