{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589935","patent":{"patent_number":"US-9589935","title":"Package apparatus and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2014-12-08T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package apparatus includes a first package module, a second package module and multiple conductive elements. The first package module includes a first molding compound layer, a first conductive pillar layer disposed in the first molding compound layer, a first internal component, and a first protection layer. The first internal component electrically connects to the first conductive pillar layer and disposed in the first molding compound layer. The first protection layer is disposed on the first molding compound layer and the first conductive pillar layer. The second package module includes a second molding compound layer, a second conductive pillar layer disposed in the second molding compound layer, and a second internal component. The second internal component electrically connects to the second conductive pillar layer and disposed in the second molding compound layer. The conductive elements are disposed between the first and the second conductive pillar layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package apparatus and manufacturing method thereof","description":"A package apparatus includes a first package module, a second package module and multiple conductive elements. The first package module includes a first molding compound layer, a first conductive pill","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589935","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589935","citation_suggestion":"Patentable. \"Package apparatus and manufacturing method thereof\" (US-9589935). https://patentable.app/patents/US-9589935","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589935","json":"https://patentable.app/api/llm-context/US-9589935","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:09:13.814Z"}