{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589937","patent":{"patent_number":"US-9589937","title":"Semiconductor cooling method and method of heat dissipation","assignee":null,"inventors":[],"filing_date":"2015-07-29T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"The invention provides a semiconductor cooling method that comprises: providing two wafers which require to be treated by a mixed bonding process, wherein each of the wafers being provided with several metallic device structure layers therein. A heat dissipation layer is set in at least one of the wafers and arranged in the free area above at least one of the metallic device structure layers, and the heat dissipation layer connects to the adjacent metallic device structure layer and the invention provides a method of heat dissipation that comprises providing at least two wafers to be bonded; and arranging some conducting wires on a surface of wafers. In addition, the method includes the steps of performing a bonding process to form a device with bonded wafers, wherein one end of the conducting wires locates in the region where the wafers generate heat, and another end extends to an external of wafers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor cooling method and method of heat dissipation","description":"The invention provides a semiconductor cooling method that comprises: providing two wafers which require to be treated by a mixed bonding process, wherein each of the wafers being provided with severa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589937","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589937","citation_suggestion":"Patentable. \"Semiconductor cooling method and method of heat dissipation\" (US-9589937). https://patentable.app/patents/US-9589937","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589937","json":"https://patentable.app/api/llm-context/US-9589937","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:10:40.458Z"}