{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589938","patent":{"patent_number":"US-9589938","title":"Semiconductor device including an embedded surface mount device and method of forming the same","assignee":null,"inventors":[],"filing_date":"2015-12-28T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including an embedded surface mount device and method of forming the same","description":"Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589938","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589938","citation_suggestion":"Patentable. \"Semiconductor device including an embedded surface mount device and method of forming the same\" (US-9589938). https://patentable.app/patents/US-9589938","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589938","json":"https://patentable.app/api/llm-context/US-9589938","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:20:01.999Z"}