{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9589945","patent":{"patent_number":"US-9589945","title":"Semiconductor package having stacked semiconductor chips","assignee":null,"inventors":[],"filing_date":"2015-07-21T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A semiconductor package includes a package base substrate, at least one first semiconductor chip disposed on the package base substrate, and at least one stacked semiconductor chip structure disposed on the package base substrate adjacent to the at least one first semiconductor chip. The at least one stacked semiconductor chip includes a plurality of second semiconductor chips. A penetrating electrode region including a plurality of penetrating electrodes is disposed adjacent to an edge of the at least one stacked semiconductor chip structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package having stacked semiconductor chips","description":"A semiconductor package includes a package base substrate, at least one first semiconductor chip disposed on the package base substrate, and at least one stacked semiconductor chip structure disposed ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9589945","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9589945","citation_suggestion":"Patentable. \"Semiconductor package having stacked semiconductor chips\" (US-9589945). https://patentable.app/patents/US-9589945","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9589945","json":"https://patentable.app/api/llm-context/US-9589945","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:03:07.521Z"}