{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9591771","patent":{"patent_number":"US-9591771","title":"Printed wiring board and method for manufacturing printed wiring board","assignee":null,"inventors":[],"filing_date":"2014-12-09T00:00:00.000Z","publication_date":"2017-03-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate compound layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed wiring board and method for manufacturing printed wiring board","description":"A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9591771","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9591771","citation_suggestion":"Patentable. \"Printed wiring board and method for manufacturing printed wiring board\" (US-9591771). https://patentable.app/patents/US-9591771","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9591771","json":"https://patentable.app/api/llm-context/US-9591771","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:32:48.315Z"}