{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9595455","patent":{"patent_number":"US-9595455","title":"Integrated circuit module with filled contact gaps","assignee":null,"inventors":[],"filing_date":"2016-06-09T00:00:00.000Z","publication_date":"2017-03-14T00:00:00.000Z","cpc_codes":["H01L","G06K","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Integrated circuit (IC) modules and methods for manufacturing the IC modules are described. In an embodiment, an IC module includes a substrate with contact gaps on which an IC die is attached with electrical connections between the IC die and the substrate. The IC module further include an encapsulation that encloses the IC die and fills first portions of the contact gaps, where the first portions of the contact gaps are located within an area of the substrate defined by the encapsulation. Second portions of the contact gaps, which are located outside of the area of substrate defined by the encapsulation, are filled with a filling material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit module with filled contact gaps","description":"Integrated circuit (IC) modules and methods for manufacturing the IC modules are described. In an embodiment, an IC module includes a substrate with contact gaps on which an IC die is attached with el","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9595455","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9595455","citation_suggestion":"Patentable. \"Integrated circuit module with filled contact gaps\" (US-9595455). https://patentable.app/patents/US-9595455","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9595455","json":"https://patentable.app/api/llm-context/US-9595455","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:14:46.939Z"}