{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9595495","patent":{"patent_number":"US-9595495","title":"Multi-level signaling for on-package chip-to-chip interconnect through silicon bridge","assignee":null,"inventors":[],"filing_date":"2015-09-28T00:00:00.000Z","publication_date":"2017-03-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"One embodiment relates to an apparatus for data communication between at least two in-package semiconductor dies. On the first semiconductor die in a package, a digital-to-analog converter (DAC) converts a plurality of binary signals to an analog signal. The analog signal is transmitted through a silicon bridge to a second semiconductor die. Another embodiment relates to a method of data communication between at least two in-package semiconductor dies. A plurality of binary signals is converted to an analog signal by a digital-to-analog converter on a first semiconductor die. The analog signal is transmitted through a silicon bridge to a second semiconductor die. Other embodiments, aspects and features are also disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-level signaling for on-package chip-to-chip interconnect through silicon bridge","description":"One embodiment relates to an apparatus for data communication between at least two in-package semiconductor dies. On the first semiconductor die in a package, a digital-to-analog converter (DAC) conve","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9595495","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9595495","citation_suggestion":"Patentable. \"Multi-level signaling for on-package chip-to-chip interconnect through silicon bridge\" (US-9595495). https://patentable.app/patents/US-9595495","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9595495","json":"https://patentable.app/api/llm-context/US-9595495","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:46:44.987Z"}