{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9595509","patent":{"patent_number":"US-9595509","title":"Stacked microelectronic package assemblies and methods for the fabrication thereof","assignee":null,"inventors":[],"filing_date":"2015-09-08T00:00:00.000Z","publication_date":"2017-03-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Stacked microelectronic package assemblies are provided, as are methods for producing stacked microelectronic package assemblies. In one embodiment, the stacked microelectronic package assembly includes a base package layer onto which a stacked bridge device is stacked. The base package layer includes, in turn, a first microelectronic package and a second microelectronic package positioned laterally adjacent the first microelectronic package. The stacked bridge device extends over the first and second microelectronic packages. A first terminal of the stacked bridge device is soldered to or otherwise electrically joined to a first backside contact of the first microelectronic package, and a second terminal of the stacked bridge device is soldered to or otherwise electrically joined to a second backside contact of the second microelectronic package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked microelectronic package assemblies and methods for the fabrication thereof","description":"Stacked microelectronic package assemblies are provided, as are methods for producing stacked microelectronic package assemblies. In one embodiment, the stacked microelectronic package assembly includ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9595509","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9595509","citation_suggestion":"Patentable. \"Stacked microelectronic package assemblies and methods for the fabrication thereof\" (US-9595509). https://patentable.app/patents/US-9595509","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9595509","json":"https://patentable.app/api/llm-context/US-9595509","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:35:41.658Z"}